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MURHD560T4, MURHD560W1T4
Preferred Device
MEGAHERTZTM Power Rectifier
Features and Benefits
* * * * *
Ultrafast 30 Nanosecond Recovery Times 175C Operating Junction Temperature High Temperature Glass Passivated Junction High Voltage Capability to 600 Volts These are Pb-Free Devices
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ULTRAFAST RECTIFIER 5.0 AMPERES 600 VOLTS
4 12
Applications
* Power Supplies * Inverters * Free Wheeling Diodes
Mechanical Characteristics
3
* * * * * *
Case: Epoxy, Molded Epoxy Meets UL 94 V-0 @ 0.125 in Weight: 0.4 g (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds ESD Ratings: Machine Model = C (>400 V) Human Body Model = 3B (>8000 V)
DPAK CASE 369C STYLES 3, 8
1 4 3 STYLE 3
1 4 3 STYLE 8
MARKING DIAGRAMS
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR, TC = 159C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction and Storage Temperature Range Symbol VRRM VRWM VR IF(AV) IFSM Value 600 Unit V
YWW UH560G STYLE 3 UH560 560W1 Y WW G
YWW 560W1G STYLE 8 = MURHD560T4 = MURHD560W1T4 = Year = Work Week = Pb-Free Package
5.0 50
A A
ORDERING INFORMATION
TJ, Tstg -65 to +175 Device C MURHD560T4G MURHD560W1T4G Package DPAK (Pb-Free) DPAK (Pb-Free) Shipping 2500 / Tape & Reel 2500 / Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
Preferred devices are recommended choices for future use and best overall value.
(c) Semiconductor Components Industries, LLC, 2010
August, 2010 - Rev. 4
1
Publication Order Number: MURHD560/D
MURHD560T4, MURHD560W1T4
THERMAL CHARACTERISTICS
Rating Maximum Thermal Resistance, Junction to Case Maximum Thermal Resistance, Junction to Ambient (Note 1) Symbol RqJC RqJA Value 2.5 49.5 Unit C/W C/W
ELECTRICAL CHARACTERISTICS
Rating Maximum Instantaneous Forward Voltage (Note 2) (IF = 5.0 Amps, TC = 25C) (IF = 5.0 Amps, TC = 125C) Maximum Instantaneous Reverse Current (Note 2) (Rated dc Voltage, TC = 25C) (Rated dc Voltage, TC = 125C) Maximum Reverse Recovery Time (IF = 1.0 Amp, di/dt = 50 Amps/ms, VR = 30 V, TJ = 25C) Symbol VF Value 2.7 1.65 10 70 30 mA Unit V
IR
trr
ns
1. Rating applies when surface mounted on a 1.5 mm FR4 PC board with a 1 oz. thick, 700 mm2 Cu area. 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.
100 IF, FORWARD CURRENT (AMPS) IF, FORWARD CURRENT (AMPS)
100
10
150C 125C 100C 25C
10
150C 125C 25C 100C
1
1
0.1
0.1
0.01
0
0.5
1.0
1.5
2.0
2.5
3.0
0.01
0
1.0
2.0
3.0
4.0
5.0
6.0
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
VF, MAXIMUM FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.0E-4 IR, REVERSE CURRENT (AMPS) 150C 125C 100C 1.0E-5
IR, MAXIMUM REVERSE CURRENT (AMPS)
1.0E-3 150C 125C 100C 1.0E-4
1.0E-6 1.0E-7 1.0E-8 25C
1.0E-5 1.0E-6 1.0E-7
25C
1.0E-9
0
100
200
300
400
500
600
1.0E-8
0
100
200
300
400
500
600
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
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2
MURHD560T4, MURHD560W1T4
100 PFO, AVERAGE POWER DISSIPATION (WATTS) 90 C, CAPACITANCE (pF) 80 70 60 50 40 30 20 10 0 20 TJ = 175C 15 SQUARE WAVE 10 dc 5
0
25
50
75
100
125
150
175
200
0
0
1
2
3
4
5
6
7
8
VR, REVERSE VOLTAGE (VOLTS)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Typical Capacitance
9 8 7 6 5 4 3 2 1 0 100 110 120 130 140 150 SQUARE WAVE dc
Figure 6. Forward Power Dissipation
IF, AVERAGE FORWARD CURRENT (AMPS)
RqJC = 2.5C/W TJ = 175C
160
170
180
TC, CASE TEMPERATURE (C)
Figure 7. Current Derating
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3
MURHD560T4, MURHD560W1T4
R(t), TRANSIENT THERMAL RESISTANCE 10
0.5 1 0.2 0.1 0.05 0.1 0.01 Single Pulse 0.01 0.000001 P(pk) t1 t2 DUTY CYCLE, D = t1/t2 0.00001 0.0001 0.001 0.01 t, TIME (s) 0.1 1.0 10 100 1000
Figure 8. Thermal Response, Junction to Case
R(t), TRANSIENT THERMAL RESISTANCE
100 0.5 0.2 0.1 0.05 0.01 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 t, TIME (s) 0.1 1.0 10 P(pk) t1 t2 DUTY CYCLE, D = t1/t2 100 1000
10
1
Figure 9. Thermal Response, Junction to Ambient
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4
MURHD560T4, MURHD560W1T4
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE) CASE 369C-01 ISSUE D
A B C A c2
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.030 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.050 --- 0.040 0.155 --- MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.76 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.51 BSC 0.89 1.27 --- 1.01 3.93 ---
E b3 L3
1 4
D
2 3
Z
DETAIL A
H
L4
b2 e
b 0.005 (0.13)
M
c C L2
GAUGE PLANE
H C L L1 DETAIL A
SEATING PLANE
A1
ROTATED 90 CW 5
SOLDERING FOOTPRINT*
6.20 0.244 3.00 0.118
STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE STYLE 8: PIN 1. N/C 2. CATHODE 3. ANODE 4. CATHODE
2.58 0.102
5.80 0.228
1.60 0.063
6.17 0.243
SCALE 3:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
MEGAHERTZ is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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5
MURHD560/D

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